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sychip SN3020 ieee802.15.4/zigbee smart energy module user manual and datasheet version: 1.1 march 8, 2011 confidential information note: sychip, inc. reserves the right to make changes in specifications at any time and without notice. the information furnished in this data sheet is believed to be accurate and reliable. however, no responsibility is assumed by sychip for its use, nor any infringements of patents or other rights of third parties resulting from its use. no license is generated under any rights of sychip or its supporters unless specifically agreed.
sychip/murata confidential page 2 of 26 SN3020 user ma nual 1.1 table of contents 1 system descriptions............................................................................................................ ......................... 4 1.1 a pplications ............................................................................................................................... .................... 4 1.2 m odule s ummary ............................................................................................................................... ........... 4 1.3 b lock d iagram ............................................................................................................................... ............... 5 1.4 a cronyms ............................................................................................................................... ......................... 5 2 mechanical specifications ...................................................................................................... ............... 6 2.1 m odule d imension ............................................................................................................................... .......... 6 2.2 m odule top and side view ............................................................................................................................. 6 2.3 m odule bottom view ............................................................................................................................... ...... 7 2.4 d etailed mechanical data ( top view ) ........................................................................................................ 8 2.5 m odule p in - out ............................................................................................................................... ............... 9 3 dc electrical sp ecifications ................................................................................................... ........... 12 3.1 t ypical p ower c onsumption ...................................................................................................................... 12 3.2 d igital io s pecification ............................................................................................................................. 12 4 rf specifications.............................................................................................................. ............................ 13 5 environmental specifications ................................................................................................... ........ 14 5.1 a bsolute maximum ratings ....................................................................................................................... 14 5.2 o peration conditions ............................................................................................................................... ... 14 6 application information........................................................................................................ ................ 15 6.1 r eference connection for uart host interface .................................................................................. 15 6.2 r eference connection for the spi host interface ................................................................................ 16 6.3 r ecommended host ( customer ) circuit board pcb pattern ................................................................ 17 6.4 h ost pcb layout recommendations ........................................................................................................ 17 6.5 m odule l ocation ............................................................................................................................... .......... 18 6.5.1 location in x-y plane.......................................................................................................... ........................ 19 6.5.2 location in z-plane............................................................................................................ ......................... 19 7 assembly information ........................................................................................................... .................. 20 7.1 l ead - free soldering reflow profile ........................................................................................................ 20 8 package information ............................................................................................................ ................... 21 8.1 t ape and reel specification ....................................................................................................................... 21 8.2 m odule marking ............................................................................................................................... ........... 22 9 ordering information ........................................................................................................... .................. 23 10 rohs declaration............................................................................................................... ......................... 23 11 regulatory information......................................................................................................... .............. 23 11.1 fcc n otice (usa) .......................................................................................................................... .............. 23 11.1.1 fcc labeling re quirem ents ...................................................................................................... ........... 24 11.1.2 rf exposure .................................................................................................................... ...................... 24 11.2 ic n otice (c anada ).............................................................................................................................. ........ 25 11.3 ce n otice (e urope ) .............................................................................................................................. ........ 25 12 technical support contact ...................................................................................................... ........... 26 13 references ..................................................................................................................... .................................. 26
sychip/murata confidential page 3 of 26 SN3020 user ma nual 1.1 list of figures f igure 1 SN3020 m odule b lock d iagram ..................................................................................................................... 5 f igure 2 m odule t op and s ide v iew .............................................................................................................................. 6 f igure 3 m odule b ottom v iew ............................................................................................................................... ....... 7 f igure 4 d etailed m echanical d ata ( top view ) .......................................................................................................... 8 f igure 5 uart h ost i nterface r eference d iagram ................................................................................................. 15 f igure 6 spi h ost i nterface r eference d iagram ...................................................................................................... 16 f igure 7 r ecommended h ost ( customer ) pcb p attern ............................................................................................ 17 f igure 8 r ecommended h ost c ircuit b oard d esign u nderneath the m odule .................................................... 18 f igure 9 r ecommended l ocations in xy - plane .......................................................................................................... 19 f igure 10 l ocations n ot r ecommended in xy - plane ................................................................................................ 19 f igure 11 r ecommended l ocations in z - plane ........................................................................................................... 19 f igure 12 l ocations n ot r ecommended in xy - plane ................................................................................................ 19 f igure 13 r eflow p rofile p attern ............................................................................................................................... 20 f igure 14 t ape d imensions ............................................................................................................................... .............. 21
sychip/murata confidential page 4 of 26 SN3020 user ma nual 1.1 1 system descriptions 1.1 applications sychip?s SN3020 module is a sta ndard-based wireless transceive r targeting the smart energy market with low power consumption, high tran smit power (20 dbm typ.) and high receiver sensitivity (-103 dbm). it is based upon th e ieee 802.15.4 wireless netw ork specification. the module can be used to develop applications s upporting the zigbee pro sm art energy application profile. the SN3020 module operates in the 2.4 ghz unlicensed ism frequency band for worldwide deployment. 1.2 module summary ? dimensions: 27.20 x 14.75 x 2.90 mm 3 ? ember em357 high-performance, integrated zigbee/802.15.4 chipset ? supply voltage: 2.4v to 3.4v ? data logging memory: 8 mbits serial flash ? security: 128-bit aes ? antenna: on-module ? host interface: spi, uart ? meter interface: i2c, gpio ? adc ports: 6 x 14-bit ? rohs compliant ? msl jedec level 3
sychip/murata confidential page 5 of 26 SN3020 user ma nual 1.1 1.3 block diagram figure 1 SN3020 module block diagram 1.4 acronyms adc analog to digital converter amr automatic meter reading gpio general-purpose input-output i2c intelligent interface controller ism industrial, scientific and medical mac medium access control msl moisture sensitivity level per packet error rate rohs restriction of hazardous substances spi serial peripheral interface uart universal asynchronous receiver-transmitter wpan wireless personal area network balun balun em357 (zigbee ic) serial flash ( 8mbit ) pa lna lpf antenna switch connector spdt xtal (24mhz) vreg out ( 1.8v ) gpio i/f spi i/f uart i/f nreset jtag
sychip/murata confidential page 6 of 26 SN3020 user ma nual 1.1 2 mechanical specifications 2.1 module dimension parameter typical units dimension (lxwxh) 27.20 x 14.75 x 2.90 mm dimension tolerances (lxwxh) 0.20 x 0.20 x 0.15 mm 2.2 module top and side view figure 2 module top and side view
sychip/murata confidential page 7 of 26 SN3020 user ma nual 1.1 2.3 module bottom view figure 3 module bottom view
sychip/murata confidential page 8 of 26 SN3020 user ma nual 1.1 2.4 detailed mechanical data (top view) pin 1 pin 13 pin 20 pin 32 figure 4 detailed mechanical data (top view)
sychip/murata confidential page 9 of 26 SN3020 user ma nual 1.1 2.5 module pin-out table 1 module connector signal description pin # pin name i/o description 1 gnd - ground 2 reserved o internal serial flash on/ off control (active low), for debugging use only 3 pc4/jtms i/o programmable i/o control available to the host, or jtag mode select 4 pb0/irqa i/o programmable i/o control available to the host, or an interrupt input 5 reserved o internal serial flash ncs, for debugging use only 6 pb6/adc1/irqb i/o programmable i/o control available to the host, or adc input, or an interrupt input 7 pc1/adc3 i/o programmable i/o control available to the host, or an adc input 8 swclk/jtck i jtag/serial wire debugging port clock 9 pc0/jrst/irqd i/o programmable i/o control available to the host, or an interrupt input, or the jtag reset input 10 gnd - ground 11 pb5/adc0 i/o programmable i/o control available to the host, or an adc input 12 gnd - ground 13 gnd - ground 14 gnd - ground 15 gnd - ground
sychip/murata confidential page 10 of 26 SN3020 user m anual 1.1 pin # pin name i/o description 16 reserved i/o not connected in SN3020. 17 gnd - ground 18 reserved o used internally as the lna on (active low), for debugging use only 19 nreset i module reset signal (internal pull-up) 20 gnd - ground 21 gnd - ground 22 pa3 i/o programmable i/o control available to the host, 23 gnd - ground 24 pc6/osc32b i/o programmable i/o control available to the host, or 32.768khz crystal 25 pc7/osc32a i/o programmable i/o control available to the host, or 32.768khz crystal 26 sc1sclk/pb3 i/o spi port 1 clock, or programmable i/o control available to the host, 27 reserved o used internally as the serial flash mosi, for debugging use only 28 reserved o used internally as the serial flash miso, for debugging use only 29 vbatt pi module power supply 30 reserved o used internally as the serial flash clock, for debugging use only 31 pa4/adc4 i/o programmable i/o control available to the host, or adc input 32 gnd - ground 33 pa5/adc5/nbootmode i/o programmable i/o control available to the host, or adc input, or boot control, must be left open or pulled high during the reset to enable the normal firmware boot process.
sychip/murata confidential page 11 of 26 SN3020 user m anual 1.1 pin # pin name i/o description 34 sc1miso(s)/ sc1mosi(m)/txd/pb1/sc1sda i/o spi port 1 miso (slave)/ mosi (master) signal, uart txd signal, i2c port 1 data signal, or programmable i/o control available to the host. 35 sc1mosi(s)/ sc1miso(m)/rxd/pb2/sc1scl i/o spi port 1 mosi (slave)/ miso (master) signal, uart rxd signal, i2c port 1 clk signal, or programmable i/o control available to the host. 36 pc2/jtdo/swo i/o programmable i/o control available to the host, or serial wire port output signal, or jtag data out 37 sc1nssel/pb4 i/o spi port 1 slave select, or programmable i/o control available to the host, 38 pc3/jtdi i/o programmable i/o control available to the host, or jtag data in 39 gnd - ground 40 gnd - ground 41 gnd - ground 42 gnd - ground 43 gnd - ground 44 gnd - ground
sychip/murata confidential page 12 of 26 SN3020 user m anual 1.1 3 dc electrical specifications 3.1 typical power consumption table 2 typical power consumption values item condition min typ max units sleep mode vcc = 3.0v, tamb = 25c internal rc oscillator on processor, radio, peripherals off 1.2 a standby mode vcc = 3.0v, tamb = 25c processor on radio and peripherals off 12 ma receive mode vcc = 3.0v, tamb = 25c radio receive chain on 35 ma transmit mode (+20dbm) vcc = 3.0v, tamb = 25c radio transmit chain on 175 ma serial controller current fo r each controller at maximum data rate 0.2 ma general purpose timer current for each timer at maximum clock rate 0.25 ma general purpose adc current at maximum sample rate, dma enabled 1.1 ma 3.2 digital io specification vcc = 3.0v, tamb = 25c, normal mode 1 unless otherwise stated table 3 digital io specification values item condition symbol min typ max units input current for logic 0 i il -0.5 a input current for logic 1 i ih 0.5 a low schmitt switching threshold schmitt input threshold going from high to low v swil 0.42 x v cc 0.5 x v cc v 1 normal mode as defined by ember for em357.
sychip/murata confidential page 13 of 26 SN3020 user m anual 1.1 high schmitt switching threshold schmitt input threshold going from low to high v swih 0.62 x v cc 0.8 x v cc v output voltage for logic 0 i ol = 4ma (8ma) for standard (high current) pads v ol 0 0.18 x v cc v output voltage for logic 1 i oh = 4ma (8ma)for standard (high current) pads v oh 0.82 x v cc v cc v output source current standard current pad i ohs 4 ma output sink current standard current pad i ols 4 ma output source current high current pad i ohh 8 ma output sink current high current pad i olh 8 ma total output current i oh + i ol 40 ma 4 rf specifications vcc = 3.0v, tamb = 25c, normal mode measured at 50 ? terminal load connected to the rf connector table 4 rf specifications parameter min typ max units frequency range 2400 2500 mhz receiver sensitivity -103 dbm maximum input signal level -20 dbm transmitter power at the maximum setting 2 20 dbm adjacent channel rejection 24 db alternate channel rejection 42 db carrier frequency error -40 +40 ppm 2 ember rf output power programmed to -12 by embersetradiopower [2] or equivalent under normal mode
sychip/murata confidential page 14 of 26 SN3020 user m anual 1.1 5 environmental specifications 5.1 absolute maximum ratings table 5 absolute maximum rating symbol description min max units t op operating temperature -40 85 c t st storage temperature -40 85 c vbatt power supply -0.3 3.6 v rfin rf input power 10 dbm msl moisture sensitivity level 3 rohs restriction of hazard ous substances compliant 5.2 operation conditions table 6 recommended operating conditions symbol parameter min typ max units vbatt power supply 2.4 3.0 3.4 3 v t op operating temperature -40 85 c 3 this value is handled by firmware to meet fcc regulation for modular approval.
sychip/murata confidential page 15 of 26 SN3020 user m anual 1.1 6 application information 6.1 reference connection for uart host interface figure 5 illustrates the connections betw een SN3020 module and the host mcu via uart interface. a level shifter may be needed if the host uart interface leve l does not match with SN3020. gpio rxd txd host uc nreset txd rxd SN3020 power supply figure 5 uart host interface reference diagram
sychip/murata confidential page 16 of 26 SN3020 user m anual 1.1 6.2 reference connection for the spi host interface figure 6 illustrates the connections between SN3020 module and the host mcu via spi interface. gpio sclk scs mosi miso host uc nreset sc1sclk sc1nssel sc1mosi sc1miso SN3020 power supply figure 6 spi host interface reference diagram
sychip/murata confidential page 17 of 26 SN3020 user m anual 1.1 6.3 recommended host (customer) circuit board pcb pattern pin 1 pin 13 pin 20 pin 32 figure 7 recommended host (customer) pcb pattern 6.4 host pcb layout recommendations the SN3020 module has an onboard an tenna therefore it requires so me special host pcb layout underneath the module such that the radio can achiev e its best rf performance. refer to figure 8 for the requirements.
sychip/murata confidential page 18 of 26 SN3020 user m anual 1.1 zone1 zone2 antenna (layer 1) gnd gnd gnd gnd gnd gnd figure 8 recommended host circuit b oard design underneath the module notes: 1. due to the surface mount antenna on the m odule, the area in ?zone1? on all layers of the customer circuit board should be free of any me tal objects. specificall y, there should be no ground plane, traces, or metal shield case. 2. the area in ?zone2? on the top layer of the customer circuit board should have ground only with no signal traces. 6.5 module location for optimum eirp, customer is advised to use the recommended m odule location on their respective pcb.
sychip/murata confidential page 19 of 26 SN3020 user m anual 1.1 6.5.1 location in x-y plane antenna connector antenna shield case no gnd in this area (see fig.8) figure 9 recommended locations in xy-plane figure 10 locations not recommended in xy-plane 6.5.2 location in z-plane antenna connector antenna metal module mother board metal figure 11 recommended locations in z-plane metal metal metal figure 12 locations not recommended in xy-plane
sychip/murata confidential page 20 of 26 SN3020 user m anual 1.1 7 assembly information 7.1 lead-free soldering reflow profile the lead-free solder reflow profile is recommended in the table & graph below. the profile is used to attach the module to its host pcb. the module is designed to withstand 2 reflows. opposite side reflow is prohibited due to the module weight. table 7 reflow profile recommendation ramp up rate 3 o c/second max maximum time maintained above 217 o c 120 seconds peak temperature 250 o c maximum time within 5 o c of peak temperature 20 seconds ramp down rate 6 o c/second max reflow profile 0 50 100 150 200 250 time, seconds temperature, c figure 13 reflow profile pattern
sychip/murata confidential page 21 of 26 SN3020 user m anual 1.1 8 package information 8.1 tape and reel specification the product will be shipped in tape and reel package. (1) dimensions of tape (plastic tape) figure 14 tape dimensions (2) dimensions of reel tbd
sychip/murata confidential page 22 of 26 SN3020 user m anual 1.1 8.2 module marking the module will be marked using a labe l suitable for reflow soldering. table 8 module marking item description a pin 1 id b model name c mfg barcode in human readable form (includes module type, date code and serial number) d certification information
sychip/murata confidential page 23 of 26 SN3020 user m anual 1.1 9 ordering information table 9 ordering information product sychip model number sychip part number evaluation kit SN3020evk 88-00143-85 module SN3020 88-00143-00/01* ? -01 is for engineering sample quantities in cut tape (ex. 5~50 pieces) ? -00 is for full producti on reel (950 pcs/reel) 10 rohs declaration given supplier declarations, this product does not contain substances that are banned by directive 2002/95/ec or contains a maximum concentration of 0.1% by weight in homogeneous materials for ? lead and lead compounds ? mercury and mercury compounds ? chromium (vi) ? pbb (polybrominated biphenyl) ? pbde (polybrominated biphenyl ether) and a maximum concentration of 0.01% by weight in homogeneous materials for ? cadmium and cadmium compounds 11 regulatory information SN3020 has obtained the certifi cations described below. 11.1 fcc notice (usa) this device complies with part 15 of the fcc ru les. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. the fcc requires the user to be notified that any changes or modi fications not expr essly approved by sychip, inc. may void the user?s authority to ope rate the equipment. while an application of the SN3020 module in a product is not required to obtain a new fcc authorization for the module, this does not preclude the possibility th at some other form of authoriza tion or testing may be required for that end product.
sychip/murata confidential page 24 of 26 SN3020 user m anual 1.1 this device using the integrated antenna has b een tested to comply with fcc cfr part 15. the device meets the requirements for modular transmitter approval as detailed in the fcc public notice da00.1407.transmitter given the following conditions: ? user must set the maximum output power level for the channel ranges listed below as defined by ieee 802.15.4 [1] using embersetra diopower or equivalent under normal mode as specified in [2]: o for channels 11 to 24, the value of -11 o for channel 25, the value of -17 o for channel 26, the value of -27 ? duty cycle of 67% allowed ? the application firmware must be written to di sable power out if the s ource voltage is greater than 3.4v* ? vbatt must be between 2.4v ? 3.4v * the voltage level may be monitored and sampled using embermeasurevddfast or equivalent just prior to calling emberinit and also within the main loop of em berznet stack. if the average of 5 samples exceeds 3450, then invoke halreboot to disable output power and restart the system. this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this eq uipment generates uses and can radiate radio frequency ener gy and, if not inst alled and used in accordance with the instructions, may cause harmful interference to ra dio communications. however, there is no guarantee that interference will not o ccur in a particular installation. if this equipment does cause harmful interference to radio or televisi on reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving ante nna, increase the separation between the equipment and receiver, connect the equipment into an outlet on a circuit different from that to which the receiver is connected, or consu lt the dealer or an experienced radio/tv technician for help. 11.1.1 fcc labeling requirements when integrating the SN3020 into a product the f cc labeling requirements must be met. this includes a clearly visible label on the outside of the finished product specifying the SN3020 fcc identifier (fcc id:qpu3020) as we ll as the notice above. the exteri or label can use wording such as ?contains transmitter module fcc id:qpu 3020? or ?contains fcc id:qpu3020? although any similar wording that expresses the same meaning may be used. 11.1.2 rf exposure this module has been certified for remote and base radio applications and is not intended to be operated within 20cm of the body. if the module will be used for portable applications, the device must undergo sar testing. the following statement must be included as a c aution statement in manua ls for the products to alert users on fcc rf exposure compliance:
sychip/murata confidential page 25 of 26 SN3020 user m anual 1.1 ?warning: to satisfy fcc rf exposure requi rements for mobile transmitting devices, a separation distance of 20cm or mo re should be maintained between the antenna of this device and persons during operation. to ensure compliance, opera tions at closer distan ces than this are not recommended.? 11.2 ic notice (canada) the term ?ic? before the certification/registrati on number only signifies that the industry canada technical specifications were met. le terme ?ic? devant le numro de certifica tion /d?enregistrement signifie seulement que les spcifications techniques industrie canada ont t respectes. this device complies with industry canada license-exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference th at may cause undesired operation of the device. cet appareil est conforme avec industrie cana da rss standard exempts de licence (s). son utilisation est soumise les deux conditions suiv antes: (1) cet appareil ne peut pas provoquer d'interfrences et (2) cet appare il doit accepter toute in terfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement du dispositif. this device complies with h ealth canada?s safety code 6 / ic r ss-210. the installer of this device should ensure that rf radiation is not emitted in excess of the health canada?s requirement. information can be obtained at: http://www.hc-sc.gc.ca/ewh-se mt/pubs/radiation/radio_guide- lignes_direct-eng.php cet appareil est conforme avec sant canada c ode de scurit 6 / ic rss-210. le programme d'installation de cet appareil doit s'assurer que les rayonnements rf n'est pas mis au-del de l'exigence de sant canada. les informations pe uvent tre obtenues: http://www.hc-sc.gc.ca/ewh- semt/pubs/radiation/radio _guide-lignes_direct-eng.php the host device should be properly labeled to id entify the module within the host device. the industry canada certificati on label of a module shall be clearly vi sible at all times when installed in the host device, otherwise the host device must be labeled to displa y the industry canada certification number of the module, preceded by the words ?contains transmitter module?, or the word ?contains?, or similar wording e xpressing the same meaning, as follows: contains transmitter module ic:4523a-SN3020 where 4523a-SN3020 is the modul e?s certification number. 11.3 ce notice (europe) this device has been tested and certified for use in the european union.
sychip/murata confidential page 26 of 26 SN3020 user m anual 1.1 if this device is used in a product, the oem ha s responsibility to verify compliance of the final product to the eu standards. a declaration of co nformity must be issued and kept on file as described in annex ii of the radio and teleco mmunications terminal equipment directive. the ?ce? mark must be placed on the oem product pe r the labeling requirements of the directive. given that the operating fre quency band is not harmonized by a few european countries, the restriction or alert sign mu st be placed along side the ?ce? mark as shown below. as of the date of this document, only france has a restriction. the rest riction is that, if the ra dio is operated outdoors in the 2450-2483.5 mhz band, the power must be lim ited to 10 mw instead of 100 mw. the oem must account for this and the product must have the alert mark. it does not require country notifications, however. 12 technical support contact sychip, inc 2805 dallas parkway, suite 400 plano, tx 75093 usa tel: (972) 202-8900 fax: (972) 633-0327 note: sychip, inc is an operating unit within murata wireless solutions 13 references [1] ieee standard 802.15.4 ? 2003 wireless medium access control (mac) and physical layer (phy) specifications for low-rate wire less personal area networks (lr-wpans) [2] ember, ?emberznet api reference: for the em35x soc platform?, 120-3022-000g, october 28 2010

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